中文

杨松

Lecturer (Higher Education Institution)

School/Department: College of Engineering
Education Level:With Certificate of Graduation for Doctorate Study
Degree:Doctoral Degree in Engineering
Professional Title:Lecturer (Higher Education Institution)
Alma Mater:中国农业大学

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一种小型的旋耕刀磨损试验装置

Release time:2023-12-02Hits:

Affilication of Author(s):

工学院（含乡镇企业学院）
Disigner of the Invention:

康敏,黄放,朱继平,杨松,傅秀清
Type of Patent:

Patent
Authorization number:

ZL201822238803.7
Authorization Date:

2019-08-16

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